Project description Core and disruptive photonic technologiesMIRAGE aims to implement cost-optimized components for terabit optical interconnects introducing new multiplexing concepts through the development of a flexible, future-proof 3D "optical engine".Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibres (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8” Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implemented for 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout. Show the project objective Hide the project objective Data centers are becoming the hot spots of internet, and content providers request a technology for practical and cost-effective upgrade to Tb/s capacities. MIRAGE is an industry-driven photonic integration project that aims to provide this technology and present a viable path to scale datarate (+640%), power (-70%) and no. of fibrer (-90%) by squeezing bulk parallel optical components into 3D integrated chips. MIRAGE will introduce new dimensions of parallelization in interconnects to gracefully upgrade capacity and density combining for the first time multi-core fiber multiplexing, coarse WDM multiplexing and multi-level modulation. To address cost, performance and volume MIRAGE relies on the strengths of Si photonics and electronics and extends it using the right synergies with established photonic integration materials (InP and glass) to provide a future-proof, upgradeable technology. MIRAGE optical board will provide efficient (2dB) vertical coupling for photonic 3D integration and compact wavelength multiplexing on 8" Si wafers. MIRAGE will exploit the efficiency of VCSEL technology to develop the first SOI-compatible 40Gb/s InP VCSELs at 1550nm and will upgrade them to 80Gb/s through simple multi-level modulation. To further address parallelization, MIRAGE will integrate the InP VCSELs in monolithic WDM arrays. Leveraging advances in single-mode multicore fiber MIRAGE aims to mitigate cabling cost and size and reduce chip area for pigtailing by developing low-cost glass multi-core interfaces with simple assembly on the SOI chip. 4-element silicon TIA and VCSEL driver arrays will be implementedfor 40 Gbaud multi-level modulation. Low-cost industry-compatible 3D assembly techniques will be optimized for high-speed electro-optic chips, bringing a >50-fold improvement in electrical vias capacitance. MIRAGE will deliver fully functional 3D PICs: a) 208 Gb/s board-level interconnect b) 320 Gb/s QSFP active optical cable (AOC) c) 960 Gb/s CXP AOC with QSFP breakout. Fields of science engineering and technologymaterials engineeringfibersnatural sciencescomputer and information sciencesinternetnatural sciencesphysical sciencesopticsnatural scienceschemical sciencesinorganic chemistrymetalloids Programme(s) FP7-ICT - Specific Programme "Cooperation": Information and communication technologies Topic(s) ICT-2011.3.5 - Core and disruptive photonic technologies Call for proposal FP7-ICT-2011-8 See other projects for this call Funding Scheme CP - Collaborative project (generic) Coordinator EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON EU contribution € 447 398,00 Address Patision 42 106 82 Athina Greece See on map Region Αττική Aττική Κεντρικός Τομέας Αθηνών Activity type Research Organisations Administrative Contact Hercules Avramopoulos (Prof.) Links Contact the organisation Opens in new window Website Opens in new window Total cost No data Participants (7) Sort alphabetically Sort by EU Contribution Expand all Collapse all AMS-OSRAM AG Austria EU contribution € 380 189,00 Address Tobelbaderstrasse 30 schloss premstatten 8141 Unterpremstatten See on map Region Südösterreich Steiermark Graz Activity type Private for-profit entities (excluding Higher or Secondary Education Establishments) Administrative Contact Yasmine Pree (Ms.) Links Contact the organisation Opens in new window Website Opens in new window Total cost No data INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Belgium EU contribution € 639 322,00 Address Kapeldreef 75 3001 Leuven See on map Region Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven Activity type Research Organisations Administrative Contact Christine Van Houtven (Mrs.) Links Contact the organisation Opens in new window Website Opens in new window Total cost No data GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH Germany EU contribution € 284 118,00 Address Otto blumenthal strasse 52074 Aachen See on map Region Nordrhein-Westfalen Köln Städteregion Aachen Activity type Other Administrative Contact Anna Lena Giesecke (Dr.) Links Contact the organisation Opens in new window Website Opens in new window Total cost No data TECHNISCHE UNIVERSITAET MUENCHEN Germany EU contribution € 480 439,00 Address Arcisstrasse 21 80333 Muenchen See on map Region Bayern Oberbayern München, Kreisfreie Stadt Activity type Higher or Secondary Education Establishments Administrative Contact Katrin Hörmann (Ms.) Links Contact the organisation Opens in new window Website Opens in new window Total cost No data ARISTOTELIO PANEPISTIMIO THESSALONIKIS Greece EU contribution € 323 260,00 Address Kedea building, tritis septemvriou, aristotle university campus 546 36 Thessaloniki See on map Region Βόρεια Ελλάδα Κεντρική Μακεδονία Θεσσαλονίκη Activity type Higher or Secondary Education Establishments Administrative Contact Nikos Pleros (Prof.) Links Contact the organisation Opens in new window Website Opens in new window Total cost No data MELLANOX TECHNOLOGIES LTD - MLNX Israel EU contribution € 267 180,00 Address Yokneam ilit industrial zone - hermon building 20692 Yokneam See on map Activity type Private for-profit entities (excluding Higher or Secondary Education Establishments) Administrative Contact Assaf Segal (Mr.) Links Contact the organisation Opens in new window Website Opens in new window Total cost No data OPTOSCRIBE LIMITED United Kingdom EU contribution € 178 058,00 Address Unit 1 rosebank park rosebank road EH54 7EJ Livingston See on map Region Scotland Eastern Scotland West Lothian Activity type Private for-profit entities (excluding Higher or Secondary Education Establishments) Administrative Contact Nicholas Psaila (Dr.) Links Contact the organisation Opens in new window Total cost No data