Obiettivo
We propose a step change in the way plasma etching processes are controlled, through understanding, measuring and controlling the key parameters determining the environment experienced by a processed substrate. We will use simulation, experiments and innovative plasma processing concepts to demonstrate robust PLASMA ETCHING OF NANO-SCALE FEATURES as well as CONTROLLED SURFACE NANO-ROUGHNESS and texture. We will use a multi-level nested approach for the understanding and optimisation of plasma processing for nanotechnology: The first level is the plasma tool and the gas phase plasma state, the second level is the surface and the features being etched, while the third level is the nano-texture and nano-roughness of the surfaces and features etched. A feedback loop will be developed to optimise simultaneously all levels of the nano-scale etching This will greatly improve the ability, especially of SMEs, to achieve reliable fabrication of nano-devices in small batch development, and in the scale-up to larger production quantities.
Campo scientifico
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyradio frequency
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringcontrol systems
- engineering and technologynanotechnology
- natural scienceschemical sciencesinorganic chemistrymetalloids
- natural sciencescomputer and information sciencessoftwaresoftware applicationssimulation software
Argomento(i)
Invito a presentare proposte
FP6-2004-IST-NMP-2
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Meccanismo di finanziamento
STREP - Specific Targeted Research ProjectCoordinatore
WITNEY OXFORDSHIRE
Regno Unito