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Micromachined terahertz systems -a new heterogeneous integration platform enabling the commercialization of the THz frequency spectrum

Resultado final

Final Evaluation of the Telecom Prototype

This deliverable is the final test report which will contain test results and the ultimate conclusions from the assessment on the proposed integrated microsystem platform.

Report on Overall MMIC Concept and Intra-Platform Interfaces

Report summarizing the overall MMIC concept, including the basic architecture of the generic circuits composing the multifunction receive/transmit MMIC, and including the concept of non-galvanic, low-loss, direct near-field coupling between the MMIC and the micromachined THz integration platform.

Risk Assessment Plan

The Risk Assessment Plan will include a Critical Path Analysis (CPA) of the main project activities, identifying risk points, and procedures to deal with them. This deliverable is marked with nature “O” (OTHER) and will be accompanied by a small written report outlining its structure and purposes in order to justify the achievement of this deliverable.

Internal and External IT Communication Infrastructure and Project Website

"The external IT communication infrastructure constitutes a guideline for communication of the M3TERA project to external target groups including conferences, marketing measures and communication channels. Furthermore this deliverable constitutes the launch of the internal M3TERA communication infrastructure including the establishment of mailing lists or a subversion server, and the M3TERA website. Deliverables marked with nature ""DEC"" will be accompanied by a small written report outlining its structure and purpose in order to justify the achievement of the deliverable."

Project Quality Plan

"The project quality plan (the project handbook) constitutes a set of project templates, explanations on the project management process, review process, quality checks, meeting organisation, which is communicated to all partners. Deliverables marked with nature ""OTHER"" will be accompanied by a small written report outlining its structure and purpose in order to justify the achievement of the deliverable."

Prototype of Fabricated and Characterized Sensor Interface

"Prototype of near-field millimeter-wave sensor interface, characterization and measurement report. Fabrication happens in WP2, as it is integrated in the microsystem platform. Deliverables marked with nature ""DEM"" will be accompanied by a small written report outlining its structure and purpose in order to justify the achievement of the deliverable."

THz Microsystem Prototypes for Telecom and THz Sensor Prototype

"Delivered, complete THz microsystems including the microsystem platform with integrated MEMS-tuneable components and sensor/antenna interfaces, and heterogeneously integrated MMIC active circuits (from WP3, D3.5). Implementations for the telecom proof-of-concept prototype (WP5) and the sensor prototype (WP6) will be delivered. Deliverables marked with nature ""DEM"" will be accompanied by a small written report outlining its structure and purpose in order to justify the achievement of the deliverable."

Data Management Plan (DMP)

As M3TERA is taking part in the Pilot on Open Research Data a first version of the DMP as an early deliverable will be provided within the first six months of the project. The purpose of the DMP is to provide an analysis of the main elements of the data management policy that will be used by the applications with regard to all the datasets that will be generated by the project. The DMP is not a fixed document, but evolves during the lifespan of the project. More developed versions of the plan can therefore be included as additional deliverables at later stages. According to the Guidelines on Data Management in Horizon 2020, the DMP should address data set reference and name, data set description, standards and metadata, data sharing and archiving and preservation (including storage and backup) on a dataset by dataset basis and should reflect the current status of reflection within the consortium about the data that will be produced.

Publicaciones

A Non-galvanic D-band MMIC-to-Waveguide Transition Using eWLB Packaging Technology

Autores: Ahmed Hassona; Zhongxia Simon He; Chiara Mariotti; Franz Dielacher; Vessen Vassilev; Yinggang Li; Joachim Oberhammer; Herbert Zirath
Publicado en: International Microwave Symposium 2017 (IMS 2017), 2017
Editor: NA
DOI: 10.5281/zenodo.815929

High Gain Antenna for Sub-Milimeter Wave Communications

Autores: A. Martìnez; I. Maestrojuan; D. Valcazar; J. Teniente
Publicado en: European Microwave Week 2016 (EuMW 2016), 2017
Editor: NA
DOI: 10.5281/zenodo.400150

3D printed antennas for Mm-wave sensing applications

Autores: A. Vorobyov, J. R. Farserotu, J.-D. Decotignie
Publicado en: 2017 11th International Symposium on Medical Information and Communication Technology (ISMICT), 2017, Página(s) 23-26, ISBN 978-1-5090-5464-0
Editor: IEEE
DOI: 10.1109/ISMICT.2017.7891759

Elliptical Alignment Holes Enabling Accurate Direct Assembly of Microchips to Standard Waveguide Flanges at sub-THz Frequencies

Autores: Campion, James; Shah, Umer; Oberhammer, Joachim
Publicado en: International Microwave Symposium 2017 (IMS 2017), 2017
Editor: IEEE
DOI: 10.5281/zenodo.896233

An Ultra Low-Loss Silicon-Micromachined Waveguide Filter for D-Band Telecommunication Applications

Autores: James Campion, Oleksandr Glubokov, Adrian Gomez, Aleksandr Krivovitca, Umer Shah, Lars Bolander, Yinggang Li, Joachim Oberhammer
Publicado en: 2018 IEEE/MTT-S International Microwave Symposium - IMS, 2018, Página(s) 583-586, ISBN 978-1-5386-5067-7
Editor: IEEE
DOI: 10.1109/MWSYM.2018.8439601

Human Physical Condition RF Sensing at THz range

Autores: Vorobyov, A.; Daskalaki, E.; Hennemann, C.; Decotignie, J.D.
Publicado en: Proceedings of 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2016
Editor: IEEE
DOI: 10.5281/zenodo.154031

High Gain Reflector Antenna for M3tera H2020 Project

Autores: I. Maestrojuan; M. Goñi; A. Martinez
Publicado en: IRMMW-THz 2017 conference, 2017
Editor: NA
DOI: 10.5281/zenodo.895924

A Direct Carrier I/Q Modulator for High-Speed Communication at D-Band Using 130 nm SiGe BiCMOS Technology

Autores: Carpenter, Sona; He, Zhongxia Simon; Zirath, Herbert
Publicado en: EuMW from 8th-13th October 2017 in Nürnberg/Germany , 2017
Editor: NA
DOI: 10.5281/zenodo.1041330

Feasibility of Remote Vital Signs Sensing with a mm-Wave CW Reflectometer

Autores: Vorobyov, Alexander; Daskalaki, Eleni; Farserotu, John
Publicado en: IEEE 38th International Conference on ELECTRONICS AND NANOTECHNOLOGY (ELNANO-2018) , 2018
Editor: NA
DOI: 10.5281/zenodo.1244160

A 100-145 GHz Area-Efficient Power Amplifier in a 130 nm SiGe Technology

Autores: Bao, Mingquan; He, Zhongxia Simon; Zirath, Herbert
Publicado en: EuMW from 8th-13th October 2017 in Nürnberg/Germany , 2017
Editor: NA
DOI: 10.5281/zenodo.1041325

A SiGe High Gain and Highly Linear F-Band Single-Balanced Subharmonic Mixer

Autores: Seyedhosseinzadeh, Neda; Nabavi, Abdolreza; Carpenter, Sona; He, Zhongxia Simon; Bao, Mingquan; Zirath, Herbert
Publicado en: Edición 1, 2017
Editor: NA
DOI: 10.5281/zenodo.1041332

A 100-140 GHz SiGe-BiCMOS Sub-Harmonic Down-Converter Mixer

Autores: Seyedhosseinzadeh, Neda; Nabavi, Abdolreza; Carpenter, Sona; He, Zhongxia Simon; Bao, Mingquan; Zirath, Herbert
Publicado en: EuMW from 8th-13th October 2017 in Nürnberg/Germany, 2017
Editor: NA
DOI: 10.5281/zenodo.2267907

Silicon Taper Based $D$ -Band Chip to Waveguide Interconnect for Millimeter-Wave Systems

Autores: Ahmed Hassona, Vessen Vassilev, Zhongxia Simon He, Chiara Mariotti, Franz Dielacher, Herbert Zirath
Publicado en: IEEE Microwave and Wireless Components Letters, Edición 27/12, 2017, Página(s) 1092-1094, ISSN 1531-1309
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/LMWC.2017.2763118

An Ultra Low-Loss Silicon-Micromachined Waveguide Filter for D-Band Telecommunication Applications

Autores: Campion, James; Glubokov, Oleksandr; Gomez-Torrent, Adrian; Krivovitca, Aleksandr; Shah, Umer; Bolander, Lars; Li, Yinggang; Oberhammer, Joachim
Publicado en: 2018
Editor: NA
DOI: 10.5281/zenodo.1462754

Derechos de propiedad intelectual

Waveguide interface and non-galvanic waveguide transition for microcircuits

Número de solicitud/publicación: P 74583
Fecha: 2018-04-18
Solicitante(s): ERICSSON AB

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