We successfully developed a design platform, realized RFID building blocks, antenna printing technology, memory processes, singulation, chip bonding technology and product integration.
At first, application, system and technology specifications were defined, whereby 5 priority use cases were defined focusing on the market needs and exploitation of CM and VGP. Towards the end of the project, with the additional knowledge gathered, the 5 uses cases passed the assessment on economical, safety and environmental feasibility.
A 'Process Design Kit' based on PP’s metal-oxide TFT technology was successfully created. Device models and a Design Rule Check file were developed and iteratively improved during the project. This PDK was used for design of mask-sets, including digital test blocks as well as analog building blocks, and ultimately for the final demonstrators.
A series of mask sets were fabricated in PragmatIC’s pilot production line and tested over the course of the project. Successful circuit designs have been realized included functional RF and digital logic building blocks, fully functional PING12 RFID circuits and prototypes of 128-bit RFID ICs including direct clock conversion from the carrier signal.
Manufacture of the 128-bit circuitry proved to be a low yield process given the realities of the pilot line. Nevertheless, validation of the underlying design and technology functionality was achieved, providing confidence in the viability of higher expected yields with the dedicated production line.
Different memory process technologies as well as different memory design variations have been evaluated. The focus changed from single bit PROM memory elements to 128-bit PROM arrays and unprecedented 1kbit PROM arrays with NFC compatible clock speeds in year 3. Laser ablation has been selected as the preferred approach to program the memory.
Printed antennas were designed and realized with additional effort on evaluating conductive inks and certified papers. A comparison of additive technologies with etching and laser cut technologies has demonstrated the benefit of printed antennas within PING. Performance, environmental and reliability tests have been performed with satisfying results. Automated roll to roll screen printing was used to show a feasible mass production process.
Many technical options for dicing and foil release has been explored, preferred methods have been identified. For the chip to antenna bonding, the flip-chip process using ICA, was the best method identified by SMT. Pick and place trials on a high-volume assembly line were performed. With respect to the chosen standards and test procedures the lifetime and reliability testing was proved to be feasible.
CM and VGP developed and tested the processes and test equipment to integrate RFID tags into paper cards and packaging. The compatibility with the existing mass manufacturing systems and the required similarities with traditional cards and packaging was successful. Both companies started their go to market activities to acquire interest in the market.
A project website (
http://www.pingproject.eu(öffnet in neuem Fenster)) has been set up during the first month of the PING project to provide information on the project to the general public.
PING has been selected as winner of the Innovation Product Award at EFECS 2017, recognizing that the PING project paves the way for trillions of interactive objects that will expand the Internet of Things to the mass market.
