2D-Pilot Line

Información del proyecto

2D-PL

Identificador del acuerdo de subvención: 101189797

DOI

10.3030/101189797

Fecha de la firma de la CE 8 Noviembre 2024

Fecha de inicio 1 Octubre 2024

Fecha de finalización 30 Septiembre 2028

Financiado con arreglo a

• Digital, Industry and Space

Coste total

€ 32 997 565,75

Aportación de la UE

€ 32 997 565,75

Coordinado por

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium

Periodic Reporting for period 1 - 2D-PL (2D-Pilot Line)

Período documentado: 2024-10-01 hasta 2025-09-30

Resumen del contexto y de los objetivos generales del proyecto

This report describes the progress at M12 of the 2D Pilot Line (2D-PL) project, which is the project’s first year. After the closure of the 2D Experimental Pilot Line (2D-EPL) we have progressed in our activities and worked towards meeting the overall project objectives. Building on the foundation established by the 2D-EPL, we continued to work on the project’s main objective: further maturing 2DM fabrication in an industrially relevant FAB environment to secure access to the 2D pilot line, with a focus on applications in photonics, electronics and sensors. To reach this goal, tool and material suppliers together with pilot line host partners have been working on testing, evaluating, optimising and designing novel materials, processes and hardware. Pilot line hosts have collaborated to optimise and compare best-known methods for making process modules, define and test measurement routines, and lay-out the foundation for collecting statistical relevant data sets in selected device and/or circuit architectures. Access to the pilot line is intended to allow external users to become acquainted with the novel technology under development, while simultaneously providing pilot line hosts insights from external validation of the offer. This includes both the set-up and sharing of the process design kits (PDKs) and the ability to participate in multi-project wafer runs (MPWs), enabling users to have their designs fabricated. To date, one hands-on training class has been hosted at imec (1-2 September 2025), offering three different PDK training sessions: graphene-based biosensors by GSEMI and AMO, photonic integrated circuits by IHP and Graphene on CMOS integration by VTT. Three MPW runs are open. Three MPW runs are open. Run 1, on “Biosensors & Liquid Biopsies” by GSEMI, focuses on graphene-based biosensors designed for liquid sample analysis, featuring passivated contacts to ensure stability in biological environments. Run 2 focuses on the development of “Graphene Photonic Integrated Circuits” (PIC) in a 200 mm pilot line, exploring various integration aspects for the realization of integrated devices, and is hosted by IHP. Run 3, hosted by VTT, is on “CMOS-Integrated Devices”, enabling the integration of graphene components with CMOS readout wafers to support scalable and low-power electronic applications.

Trabajo realizado desde el comienzo del proyecto hasta el final del período abarcado por el informe y los principales resultados hasta la fecha

The main results of the 2D-PL project are presented in specific sections for the different work packages (WPs). Here, we focus on the key results achieved from M1 to M12.

The material classes in scope for pilot line developments within the 2D-PL project are graphene and transition metal dichalcogenides (TMDCs), with a current focus on MoS2 and WS2. WP1 and WP2 address the activities required to develop and mature the process modules for graphene and TMDCs, respectively. While many common considerations exist for the process steps of these layered materials, each requires dedicated solutions to reach higher technology readiness levels. For graphene, advancements have been made by including pretreatment of copper foils prior to growth, template-based growth, carrier-based transfer methods, and the use of specialized adhesives—all contributing to improved uniformity and intrinsic graphene quality. The approach for TMDCs involves templated growth on 200 mm sapphire wafers, ensuring compatibility with standard FAB infrastructure and enabling transfers to both 200 mm and 300 mm wafers.

In WP3 and WP4, the integration efforts are application specific. WP3 targets photonics applications, for which dedicated devices and circuits are designed to maximize performance. WP4 addresses sensors and electronics, which require distinct integration routes and device architectures tailored to their respective application needs. Differentiators include active area dimensions, defect tolerance, and preferred materials and process selection. Collaboration with WP5 has led to the establishment of initial protocols for measurement and analysis, with ongoing work to automate these approaches. This work package also contributes to standardization activities for novel materials.

WP6 focuses on enabling access to the pilot line. Both PDKs and MPW services provide opportunities for users to gain insights into the new technology and allow them to test their own devices or circuits. To support the community, a first hands-on training on the PDKs was hosted, and a support program was launched to reduce participation fees in MPW run calls. Outreach activities have been refined to reach more targeted user groups. WP7, together with the other WPs, ensures efficient project management is in place.

Avances que van más allá del estado de la técnica e impacto potencial esperado (incluida la repercusión socioeconómica y las implicaciones sociales más amplias del proyecto hasta la fecha)

The foundation for the exploitation and dissemination activities is the continuation of the path laid out by the 2D-EPL, using the same unique brand identity, a website, and a series of workshops to communicate the project's progress and reach out to potential customers. Moreover, a single access point for process services and MPW runs is provided through the EUROPRACTICE portal, while the 2D-PL website (2dpl.eu) supports communication efforts. In total, three MPW calls have been launched: (1) biosensors and liquid biopsies by GSEMI , (2) graphene photonic integrated circuits in IHP’s 200 mm pilot line, and (3) CMOS-integrated devices hosted by VTT. A first hands-on training session on the PDKs was provided, allowing initial insights into the technology under development. Furthermore, the project partners have actively disseminated their work at various international conferences. The 2D-PL contributed to Graphene Week 2024 and 2025 through the organization of workshops. An exhibition was prepared by CUT, with support from project partners, for Graphene Week 2025, showcasing the 2D-PL processes, wafers, and even an end-customer device, which will be further used at industry exhibitions.