Objective The major objective of this project is the realization of the brand new Patent pending Embedded Micro Connector Injection Process (EMCI-Process) technology, developed by the company ITC INTERCIRCUIT, Munich, for the benefit of the printed circuit board manufacturing industry, with a special consideration of environmental and cost cutting factors. The EMCI-Process together with Printed Circuit Boards (PCBs), of 100 f-lm microvias, would be used to establish a robust and reliable fine-pitch technology in combination with a traditional PCB printed wire pattern process sequence. The EMCI boards would be developed so that they would then be compatible with fine pitch naked dice for flip-chip or wire bonding and would have an enhanced rout ability for dense area array packages (f-lBGAs -micro Ball Grid Arrays, CSPs -Chip Scale Packages), insuring compatibility with SMD technology The developed connecter pins (metal or eventually glass fiber) would meet the conditions of their use. Micro component inclusion in contact pins would be studied, together with injection methods for all pin types, into and under the surface of the PCB's, creating the possibility of a 3-D circuit board space. The developing of necessary machines and tools needed for the EMCI-process, the accelerator, the injector firing the pins into the board, considering aspects such as production testing, and reaching the aim of reducing the chemical use during the PCB production. The creation of suitable EMCI processed boards for use as core multi-layer boards for sequential build-up. Also during the R&D stages the creation of a new printed circuit layout design system by adapting established CAD systems, determining special EDA designs. Building a functional demonstrator to validate the research work. Meeting the requirements which facilitate the cooperation together and involvement with other SME's, and universities from different European countries, in pan European research activities... Fields of science engineering and technologymaterials engineeringfibersnatural sciencescomputer and information sciencesinternet Keywords Embedding of connections and materials in PCB Layers New Materials PCB Programme(s) FP6-SME - Horizontal research activities involving SMEs: Specific activities covering wider field of research under the Focusing and Integrating Community Research programme 2002-2006. Topic(s) SME-1 - Co-operative Research (all areas of science and technology) Call for proposal Data not available Funding Scheme COOPERATIVE - Coordinator I.T.C. INTERCIRCUIT ELECRONIC GMBH EU contribution No data Address Wasserburger Landstrasse 280 MUENCHEN Germany See on map Total cost No data Participants (6) Sort alphabetically Sort by EU Contribution Expand all Collapse all FEINWERKBAU WESTINGER & ALTENBURGER GMBH Germany EU contribution No data Address Neckarstrasse 43 OBERNDORF See on map Total cost No data KEKON CERAMIC CAPACITORS Slovenia EU contribution No data Address Grajski trg 15 ZUSEMBERK See on map Total cost No data EUROPRINT N.V. Belgium EU contribution No data Address Zandvoorstraat 21 MECHELEN See on map Total cost No data FRIEDRICH-ALEXANDER UNIVERSITÄT ERLANGEN - NÜRNBERG Germany EU contribution No data Address Schlossplatz 4 ERLANGEN See on map Total cost No data TECHNISCHE UNIVERSITÄT ILMENAU Germany EU contribution No data Address Max-Planck-Ring, 14 100565 ILMENAU See on map Total cost No data BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS Hungary EU contribution No data Address Goldman t.3 BUDAPEST See on map Total cost No data