Obiettivo - To establish sequential processes including rapid thermal clean (RTC), DRAM or EEPROM stack (Rapid Thermal Oxidation/Nitration: RTO/N) and rapid CVD of doped poly or nitride (RTCVD).- To examine technical processes, equipment economics (CoO) and reliability for the hot processing cluster-tool.- To compare technological performance and economics of the cluster tool with standard batch processing.The performance of a four port hot cluster delivered by ASMI (platform and CVD modules) and by AST (RTP modules) will be assessed at SIEMENS in Munich. The final goal is to demonstrate technological superiority of clustered single wafer processing of very thin films over batch processes. This should lead to competitive cost of ownership figures even with lower throughput for single wafer processing. Campo scientifico social scienceseconomics and businesseconomicsnatural scienceschemical scienceselectrochemistryelectrolysisengineering and technologymaterials engineeringcoating and films Programma(i) FP4-ESPRIT 4 - Specific research and technological development programme in the field of information technologies, 1994-1998 Argomento(i) 2.9 - Building blocks, methods & tools for semiconductor app&techs Invito a presentare proposte Data not available Meccanismo di finanziamento ACM - Preparatory, accompanying and support measures Coordinatore Siemens Ag, Semiconductor Group Contributo UE Nessun dato Indirizzo Balanstrasse 73 81541 Muenchen Germania Mostra sulla mappa Costo totale Nessun dato
