The work in this project is divided in three main technological parts corresponding to the three assessed instruments. Towards the end of the project, the scope of the metrological solutions developed will be further enlarged by combining the results of several of these solutions together.
Assessment of IONTOF TOFSIMS for 3D-structure
The workpackage devoted to the TOFSIMS instrument performed in this reporting period is divided in three sub-section.
First, a thorough assessment of the instrument performances has been performed.
Second, tests have been performed on actual systems: crater depth measurement using the AFM module, as well as topographical and chemical information were combined in order to provide a 3-dimensional image of epitaxially grown SiGe structure.
Third, the evaluation of non-conventional AFM measurement modes has been evaluated.
Assessment of Capres microHALL-A300 for 3D structure
The second main workpackage is centered around the microHALL-A300 tool of Capres. This fully automated in-line tool implements two techniques, namely micro four-point probe and microHall. The purpose is to evaluate the tool on both semiconducting and metallic materials.
For semiconducting materials, we test first the tool on the materials and structures (blanket or micron-scale pad geometry) of Si, Ge, SiGe and III-V semiconductors. It included a new software taking the current confinement in small pads. Next, we evaluate the potential extension of the tool capabilities towards more relevant nanoscale semiconducting volumes: In structures involving Si and III-V materials in a long fin-like geometry, where the tool has shown to be very successful in determining the resistance in fins with width as low as 20 nm.
In the next part of this workpackage, we evaluated how the tool performs on ultra-thin metal films.
Assessment of PVA TePla GHz Scanning Acoustic Microscope
The assessment of acoustic microscopy in the GHz-band for non- and semi-destructive inspection of 3D-relevant technologies in microelectronics is the focus of the third large workpackage. Extending the acoustic frequency into the GHz-band allows for a significantly increased spatial resolution compared to conventional SAM. Furthermore, the use of acoustic lenses with large numerical apertures enable the excitation of additional wave modes and thus extend the value and potential of this non-destructively operating inspection technique.
This workpackage focusses on three main subtasks: First the assessment of GHz-SAM for failure analysis and metrology tasks for BEOL materials and structures. Second, the assessment of GHz-SAM for failure analysis and metrology tasks for 3D-relevant systems and structures. The third task focusses on the validation and verification of the acoustically obtained results and the implementation of the GHz-SAM inspection technique into complex metrology and failure analysis work flows.
