Objective
The “Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level” project (MICROPRINCE) is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (µTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transfer printed to demonstrate the capabilities of the technology and pilot line. Based on several EU and national research activities demonstrating successfully the feasibility of µTP technology in a scientific and laboratory environment, the MICROPRINCE consortium has the goal to setup the first worldwide open access foundry pilot line for heterogeneous integration by µTP and to demonstrate its capability on five defined target application scenarios. For this purpose, the consortium consisting of 13 partners from four different countries combine their expertise along the value chain from materials and equipment, technology and semiconductor processing, integrated circuit and system design, test and application. The partners are industrial companies incl. SME’s, accompanied by leading research institutes with a clear focus on production and application in Europe. The working principle of the micro-transfer-printing technology is to use a micro-structured elastomer stamp to transfer microscale functional components from their native substrates onto non-native substrates. The lateral dimensions of the functional components can range from a few microns to a few hundreds of microns with thicknesses of only a few microns. The native substrate contains the functional components to be printed and is flexible in size and material. The MICROPRINCE pilot line is acting as a regional and nationwide competence cluster for a novel technology with European dimensions for heterogeneous system integration and supports the ECS industry to reach leadership in key applications.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors optical sensors
- natural sciences physical sciences electromagnetism and electronics semiconductivity
- natural sciences chemical sciences inorganic chemistry metalloids
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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H2020-EU.2.1.1. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)
MAIN PROGRAMME
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H2020-EU.2.1.1.7. - ECSEL
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
ECSEL-IA - ECSEL Innovation Action
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) H2020-ECSEL-2016-2-IA-two-stage
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
99097 Erfurt
Germany
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.